AMD CrossFire 480X User Manual

AMD CrossFire™ Series Chipset  
Packaging and Branding Guidelines  
Summary of All Products Belonging to  
the AMD CrossFire™ Series Chipset  
The list below summarizes the CrossFire™ Chipset product offering  
for the AMD platform  
BRAND NAMES  
ASIC Variant  
RD480  
Platform  
DT  
Chipset  
AMD 480X  
AMD 550X  
AMD 580X  
RD550  
DT  
RD580  
DT  
A M D 5 8 0 X  
Master  
Brand  
Logic  
Multi  
GPU  
3
AMD CrossFire Chipset  
Section 1  
Logos and Text Treatment  
4
AMD CrossFire Chipset  
Logos and Text Treatment  
Logos and text treatments lend brand value to your marketing and packaging.  
By including these graphic elements in your packaging, you create immediate  
awareness and connection with your audience.  
This guide outlines the proper usage of all AMD Chipset logos.  
All logos must be used as is and cannot be altered in any way.  
If there are any questions regarding these logo or brand identity guidelines,  
please contact your regional partner marketing manager.  
5
AMD CrossFire Chipset  
Logos and Text Treatment  
AMD should be in full caps. All AMD Chipset and product feature names should  
be spelled out in lower case with the first letter capitalized. Do not spell the  
entire product or product feature name in capital letters only. For ‘CrossFire’,  
‘C’ and ‘F’ are in capital letters and should be followed by “TM”.  
Correct Examples  
Incorrect Examples  
AMD 580X CrossFire™ Chipset  
AMD 580X CrossFire™ Chipset  
AMD 580X CrossFire™ Chipset  
AMD 480X CROSSFIRE™ Chipset  
Amd 480X Crossfire™ Chipset  
AMD 480X CrossFire Chipset  
Note: ASIC variant name (i.e R580) is NOT to be used at anytime.  
6
AMD CrossFire Chipset  
Logos and Text Treatment  
Use of trademark “™” and “®”  
COPY  
In all copy, the applicable trademark notice must be used beside all product  
and product feature names used in: (i) all headlines; and (ii) the first use of  
the product or product feature name in the text.  
PACKAGING  
The applicable trademark notice must be used beside all product names  
prominently featured (greater than 2X text size) on the packaging. For all  
packaging copy, the applicable trademark notice must be used beside the first  
instance of use of all product and product feature names used in the text.  
NOTICE SYMBOL  
Registered marks should be followed by the “®” notice symbol. All other  
product and product feature names for which AMD is claiming trademark rights  
or for which AMD has filed a trademark application should be followed by the  
“™” notice symbol. Please check with the Chipset Marketing Department to  
ensure you are using the correct notice symbol.  
7
AMD CrossFire Chipset  
Logos and Text Treatment  
Using AMD CrossFire Chipset Logos  
Use AMD CrossFire Chipset logos when promoting motherboards or systems  
with these chipset.  
The logos must be used in the following applications:  
On the heat sink for Northbridge. (Logo on the Southbridge is optional)  
On the PC boot up screen (BIOS Splash)  
On retail packaging  
Advertising and promotional material (print and online)  
8
AMD CrossFire Chipset  
Logos and Text Treatment  
This logo is used on the Northbridge and or Southbridge on the Motherboard  
heat sink  
File name: _HS.eps  
These logos are used on the PC boot up Screen (BIOS Splash), for  
motherboard packaging (see packaging guidelines for more details),  
advertisement, collateral material etc.  
Logo Use  
File name:  
Splash Screen _BIOS.bmp  
Print/Package _PRINT.eps  
Web/Electronic _GP  
9
AMD CrossFire Chipset  
Logos and Text Treatment  
Requirements for BIOS Splash Screen Logo  
The BIOS Splash screen logo must be placed either in the center of the  
monitor or the upper top left-hand corner of the screen  
The logo must be no smaller than 2 inches in width (length to be proportional)  
The logo must be present for a minimum of 2 seconds  
2 inches  
10  
AMD CrossFire Chipset  
Section 2  
Packaging Guidelines  
11  
AMD CrossFire Chipset  
Packaging Guidelines  
These packaging standards have been developed to provide consistent brand  
recognition for the logo established for all AMD products, and to more clearly  
communicate the consumer benefits of AMD products.  
Please follow these guidelines for all motherboard packaging with the AMD  
CrossFire chipset product line.  
12  
AMD CrossFire Chipset  
Packaging Guidelines  
Mandatory Box Layout Requirements:  
There is only one mandatory element for all partner packaging:  
The AMD CrossFire Chipset product logo MUST be on the front and back panels  
of the retail box.  
This elements must be reproduced without variation in the positions identified.  
Partner artwork can then be placed in the grey zones of the marked illustration  
below.  
13  
AMD CrossFire Chipset  
Packaging Guidelines  
Other Mandatory Requirements:  
1. The proportion of logo size to package area shown must be maintained  
(see below)  
2. To ensure sufficient visibility, an unobstructed area should surround the  
Chipset badge logo.  
3. The ™ should be placed after CrossFire. The ™ must always appear at  
least once.  
4. Pantone color 347 is always used for AMD green. Pantone color 185 is  
always used for CrossFire red.  
5. Partners must include the following standard legal line on all packaging or  
other advertising materials which utilize any AMD logos or visual identities:  
“AMD, the AMD Arrow logo, ATI, CrossFire, Radeon, and combinations  
thereof are trademarks of Advanced Micro Devices, Inc. Other names are  
for informational purposes only and may be trademarks of their respective  
owners.”  
14  
AMD CrossFire Chipset  
Packaging Guidelines  
Logo Sizing Requirements  
1. Logo must be 0.375” away from box edge and other logos.  
2. The logo must be at least 2” wide.  
2”  
0.375”  
15  
AMD CrossFire Chipset  
Packaging Guidelines  
Incorrect Use of Chipset Package Art Template  
1. The chipset badge logo is not placed on the front/top side of the packaging  
2. The badge is two small, not meeting the 2” wide criteria  
3. Partners may not add unauthorized numeric or alphabetical extensions  
after the Chipset technology brand name. e.g. AMD 580X Pro Lite etc.  
4. The Chipset badge cannot be place in alternative locations on a partner  
pack  
2”  
16  
AMD CrossFire Chipset  

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